Internal stress and elastic modulus measurements on micromachined 3c-sic thin films

IEEE Transactions on Electron Devices

Volumn 44, Issue 1, 1997, Pages 74-79

  Mehregany, Mehran ^a   Tong, Lijun ^a   Malus, Lawrence G ^a   Larkin, David J ^a  

^a Case Western Reserve University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; ELASTIC MODULI; EPITAXIAL GROWTH; MICROMACHINING; RESIDUAL STRESSES; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES;

BIAXIAL MODULUS; LOAD DEFLECTION MEASUREMENTS;

THIN FILMS;

EID: 0030846945     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/16.554795     Document Type: Article

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