Selective W for coating and releasing MEMS devices

Materials Research Society Symposium - Proceedings

Volumn 605, Issue , 2000, Pages 135-140

  Mani, S S ^a   Fleming, J G ^b   Sniegowski, J J ^b   De Boer, M P ^b   Irwin, L W ^b   Walraven, J A ^b   Tanner, D M ^b   La Van, D A ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; INTEGRATED CIRCUIT MANUFACTURE; OXIDES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PROCESS CONTROL; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; STICTION; SURFACE TREATMENT; TUNGSTEN; WEAR RESISTANCE;

DIMPLES; MICROENGINES; RELEASING PROCESS; SACRIFICIAL OXIDES;

MICROELECTROMECHANICAL DEVICES;

EID: 0034499771     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

1. R. T. Howe and R. S. Muller, J. Electrochem Soc: Solid State Science & Technology, 103(6) p. 1420 (1983).
2. E. J. Garcia and J. J. Sniegowski, Sensors and Actuators A, 48, p. 203 (1995).
3. S. L. Miller, J. J. Sniegowski, G. LaVigne, and P. J. McWhorter in Proceedings of SPIE Smart Electronics and MEMS 2722, p. 197 (1996).
4. Danelle M. Tanner, W. M. Miller, W. P. Eaton, L. W. Irwin, K. A. Peterson, M. T. Dugger, D. C. Senft, N. F. Smith, P. Tangyunyong, and S. L. Miller in 1998 IEEE International Reliability Physics Proceedings, p. 26 (1998).
5. Danelle M. Tanner, Jeremy A. Walraven, Lloyd W. Irwin, Michael T. Dugger, Norman F. Smith, William M. Miller, and Samuel L. Miller in Proc. Of IEEE International Reliability Physics Symposium, p. 189 (1999).
6. K. Deng, R. J. Collins, M. Mehrengany and C. N. Sukenik, J. Elctrochem. Soc., 142(4), p. 1278 (1995).
7. U. Srinivasan, M. R. Houston, R. T. Howe and R. Maboudian, J. Micromech. Sys., 7(2), p. 252 (1998).
8. D. R. Bradbury, J. E. Turner, K. Nauka and K. Y. Chiu, IEDM, p. 273, (1991).
9. M. Sekine, Y. Kakuhara, K. Yamazaki and Y. Murao, MRS Advanced Metallization ULSI Applications, p. 255, (1991).
10. M. L. Yu, B. N. Eldridge, and R. V. Joshi, in Deposition and Growth: Limits for Microelectronics, edited by G. W. Rubloff (AIP Conf. Proc. 167, New York 1988), p. 202.
11. E. K. Broadbent and C. L. Ramiller, J Elctrochem. Soc.: Solid-State Science and Techonolgy, 131(6), p. 1427 (1984).
12. M. L. Green and R. A. Levy, J Elctrochem. Soc.: Solid-State Science and Techonolgy, 132(5), p. 1243 (1985).
13. M. L. Yu, B. N. Eldridge, and R. V. Joshi, in Tungsten and Other Refractory Metals for VLSI Applications III, edited by V. A. Wells (MRS Proc. Pittsburgh, PA), 1988, p. 75.
14. A. Kepten, A. Reisman, M. Ray, P. L. SMith, D. Temple, and F. Tapp, J. Electrochem. Soc, 139(8), p. 2331 (1992).
15. S. S. Mani, J. G Fleming, and J. J. Sniegowski in Proceedings of SPIE, Micromachining and Microfabrication Process Technology V, 3874, p.150 (1999).
16. S. L. Miller, J. J. Sniegowski, G. LaVigne, and P. J. McWhorter in Proceedings of SPIE Micromachined Devices and Components II, 2882, p. 182 (1996).
17. Norman F. Smith, William P. Eaton, Danelle M. Tanner, and James J. Allen in SPIE Proceedings, 3880, p. 156 (1999).
18. S. L. Miller, M. S. Rodgers, G. LaVigne, J. J. Sniegowski, P. Clews, D. M. Tanner, K. A. Peterson in Proc. Of IEEE International Reliability Physics Symposium, p. 17 (1998).
19. LaVan, D. A. and T. E. Buchheit in Symposium MM Materials Science of MicroElectroMechanical System (MEMS) Devices II, Proceedings of the 1999 MRS Fall Meeting Dec 1-3 1999 Boston.