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Diamond and Related Materials

Volumn 10, Issue 11, 2001, Pages 1952-1961

Ultrananocrystalline diamond thin films for MEMS and moving mechanical assembly devices

(14) Krauss, A R a,g Auciello, O a Gruen, D M a Jayatissa, A a Sumant, A a Tucek, J a Mancini, D C a Moldovan, N a Erdemir, A a Ersoy, D b Gardos, M N c Busmann, H G d Meyer, E M e Ding, M Q f

a ARGONNE NATIONAL LABORATORY (United States)

b University of Illinois Chicago (United States)

c Electronic Systems (United States)

d FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM (Germany)

e UNIVERSITY OF BREMEN (Germany)

f INSTITUTE OF ELECTRONICS (China)

g UNIVERSITY OF CHICAGO (United States)

Author keywords

Assembly devices; Diamond thin films; Ultrananocrystalline

Indexed keywords

BENDING (DEFORMATION); FABRICATION; FRACTURE; GRAIN SIZE AND SHAPE; HYDROPHILICITY; SILICON; THIN FILMS; TRIBOLOGY; VAPOR DEPOSITION;

VIBRATION SENSORS;

DIAMONDS;

DIAMOND COATING; FABRICATION; MICROELECTROMECHANICAL SYSTEM; TRIBOLOGY;

EID: 0035499507 PISSN: 09259635 EISSN: None Source Type: Journal
DOI: 10.1016/S0925-9635(01)00385-5 Document Type: Article

Times cited : (351)

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