SCOPUS 정보 검색 플랫폼

Volumn 41, Issue 9-10, 2001, Pages 1409-1416

Invited paper: Electromigration performance of multi-level damascene copper interconnects

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; CURRENT DENSITY; ELECTROMIGRATION; LITHOGRAPHY; PROCESS CONTROL; SCANNING ELECTRON MICROSCOPY;

DAMASCENE COPPER;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0035456867 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2714(01)00162-7 Document Type: Article

Times cited : (54)

References (7)

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- Edelstein, D. et al., Full Copper Wiring in a Sub-0.25um CMOS ULSI Technology, in Proceedings of 1997 International Electron. Devices Meeting, Technical Digest (1997), pp.773-776.
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- Edelstein, D.¹

2
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- Full-0.56um pitch copper interconnects for a high performance 0.15-um CMOS Logic Devices
- Iguchi, M. et al., Full-0.56um Pitch Copper Interconnects for a High Performance 0.15-um CMOS Logic Devices, in Proceedings of 1999 International Electron. Devices Meeting, Technical Digest ( 1999), pp. 615-618.
- (1999) Proceedings of 1999 International Electron. Devices Meeting, Technical Digest , pp. 615-618
- Iguchi, M.¹

3
- 0032083909
- Electromigration failure modes in damascene copper interconnects
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- (1998) Microelectronics Reliability , vol.38 , pp. 1029-1034
- Arnaud, L.¹ Gonella, R.² Tartavel, G.³ Torres, J.⁴ Gounelle, C.⁵ Gobil, Y.⁶ Morand, Y.⁷

4
- 85013613367
- Scaling effect on electromigration in on-chip cu wiring
- Hu, C.-K., R. Rosenberg, H.S. Rathore, D.B. Nguyen, and B. Agarwala, Scaling Effect on Electromigration in On-Chip Cu Wiring, in Proceedings of 1999 International Interconnect Technology Conference (1999), pp.267-269.
- (1999) Proceedings of 1999 International Interconnect Technology Conference , pp. 267-269
- Hu, C.-K.¹ Rosenberg, R.² Rathore, H.S.³ Nguyen, D.B.⁴ Agarwala, B.⁵

5
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- Electromigration path in cu thin-film lines
- Hu, C.-K., R. Rosenberg, and K.Y. Lee, Electromigration path in Cu thin-film lines, Appl. Phys. Lett., 74 (1999) pp.2945-2947.
- (1999) Appl. Phys. Lett. , vol.74 , pp. 2945-2947
- Hu, C.-K.¹ Rosenberg, R.² Lee, K.Y.³

6
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- Electromigration reliability study of submicron cu interconnections
- Hu, C.-K., R. Rosenberg, W. Klassen, and A.K. Stamper, Electromigration Reliability Study of Submicron Cu Interconnections, in Proceedings of 2000 Mater. Res. Soc. Symp. (2000), pp.691-697.
- (2000) Proceedings of 2000 Mater. Res. Soc. Symp. , pp. 691-697
- Hu, C.-K.¹ Rosenberg, R.² Klassen, W.³ Stamper, A.K.⁴

7
- 0000555230
- Mechanisms for very long electromigration lifetime in dual-damascene cu interconnections
- Hu, C.-K., L.Gignac, S.G. Malhotra, R. Rosenberg, and S. Boettcher, Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections, Appl. Phys. Lett., 78 (2001) pp.904-906.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.