Electromigration failure model: Its application to W plug and Al-filled vias

Thin Solid Films

Volumn 320, Issue 1, 1998, Pages 45-51

  Kawasaki, H ^a   Gall, M ^a   Jawarani, D ^a   Hernandez, R ^a   Capasso, C ^a  

^a MOTOROLA INC   (United States)

Author keywords

Al Cu interconnect; Electromigration; Tungsten plug

Indexed keywords

ALUMINUM; COPPER; ELECTROMIGRATION; FAILURE ANALYSIS; MATHEMATICAL MODELS; METALLIZING; TUNGSTEN; VLSI CIRCUITS;

ALUMINUM COPPER INTERCONNECT; TUNGSTEN PLUG;

THIN FILMS;

EID: 0032482022     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)01072-9     Document Type: Article

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