Reduced-order models for MEMS applications

Nonlinear Dynamics

Volumn 41, Issue 1-3, 2005, Pages 211-236

  Nayfeh, Ali H ^a   Younis, Mohammad I ^b   Abdel Rahman, Eihab M ^a  

^a State University   (United States)

^b State University of New York at Binghamton   (United States)

Author keywords

MEMS; Microbeams; Microplates; Reduced order models; Squeeze film damping; Thermoelastic damping

Indexed keywords

DAMPING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MODAL ANALYSIS; PARTIAL DIFFERENTIAL EQUATIONS; THERMOELASTICITY;

MEMS; MICROBEAMS; MICROPLATES; REDUCED-ORDER MODELS; SQUEEZE-FILM DAMPING; THERMOELASTIC DAMPING;

MICROELECTROMECHANICAL DEVICES;

EID: 21844478095     PISSN: 0924090X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11071-005-2809-9     Document Type: Article

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