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Angewandte Chemie - International Edition

Volumn 42, Issue 45, 2003, Pages 5548-5554

Atomic Layer Deposition Chemistry: Recent Developments and Future Challenges

(2) Leskelä, Markku a Ritala, Mikko a

a UNIVERSITY OF HELSINKI (Finland)

Author keywords

Atomic layer deposition; Microelectronics; Nitrides; Oxides; Thin films

Indexed keywords

ALUMINUM; COPPER; DEPOSITION; INTEGRATED CIRCUITS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; PROTECTIVE COATINGS; SILICA; THIN FILMS;

ATOMIC LAYER DEPOSITION (ALD);

PERMITTIVITY;

ALUMINUM; COPPER; OXIDE; SILICON DIOXIDE; TRANSITION ELEMENT;

ATOMIC LAYER DEPOSITION; CHEMISTRY; COST EFFECTIVENESS ANALYSIS; DIELECTRIC CONSTANT; ELECTRIC CAPACITANCE; ELECTRONICS; EXCITATION CONTRACTION COUPLING; FILM; OPTICS; SHORT SURVEY; SURFACE PROPERTY; TECHNIQUE; THICKNESS;

EID: 0344667722 PISSN: 14337851 EISSN: None Source Type: Journal
DOI: 10.1002/anie.200301652 Document Type: Short Survey

Times cited : (986)

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