Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 4, 2000, Pages 2016-2020

  Rossnagel, S M ^a   Sherman, A ^b   Turner, F ^b  

^a IBM RESEARCH   (United States)

^b Sherman and Associates   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 23044522146     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (18)

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