Three-dimensional memory module

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 1, 1998, Pages 15-19

  Takahashi, Nobuaki ^a   Senba, Naoji ^a   Shimada, Yuzo ^a   Morisaki, Ikushi ^a   Tokuno, Kenichi ^a  

^a NEC CORPORATION   (Japan)

Author keywords

3 DM module; Cost of fabrication; Fabrication process; Memory capacity; Next generation memory device; Packaging density

Indexed keywords

ELECTRONICS PACKAGING; PRODUCT DESIGN; RANDOM ACCESS STORAGE;

DYNAMIC RANDOM ACCESS MEMORY (DRAM); THIN SMALL OUTLINE PACKAGES (TSOP); THREE DIMENSIONAL MEMORY MODULES;

MULTICHIP MODULES;

EID: 0031999513     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.659501     Document Type: Article

References (6)

1. N. Senba, Y. Shimada, K. Tokuno, and I. Morizaki, "Stack memory module," in Proc. Electron. Soc. Conf. IEICE, Sept. 1995, no. 2, p. 17.
2. C. L. Bertin, D. J. Perlman, and S. N. Shanken, "Evaluation of three-dimensional memory cube system," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 16, pp. 1006-1011, Dec. 1993.
3. A. C. Vera and M. Masgrangeas, "256 Mbits MCM-V memory stack," in Proc. ICEMCM, Apr. 1995, pp. 24-29.
4. S. H. Ahn, "Development of low-cost three-dimensional packages," in Proc. ICEMCM, Apr. 1995, pp. 268-278.
5. D. Maliniak, "Memory-chip stacks send density skyward," Electron. Design, pp. 69-75, Aug. 1994.
6. Nikkei Microdevices. Mar. 1995, pp. 28-32.