Ultra-low resistance, through-wafer via (TWV) technology and its applications in three dimensional structures on silicon

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 38, Issue 4 B, 1999, Pages 2393-2396

  Soh, Hyongsok T ^a   Patrick Yue, C ^a   Mccarthy, Anthony ^b   Ryu, Changsup ^a   Lee, Thomas H ^a   Simon Wong, S ^a   Quate, Calvin F ^a  

^a STANFORD UNIVERSITY   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

Copper metallization; Electro plated photoresist; High aspect ratio etching; Silicon etching; Three dimensional inductor; Through wafer via

Indexed keywords

EID: 0001081074     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.38.2393     Document Type: Article

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