A review of 3-D packaging technology

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 1, 1998, Pages 2-14

  Al sarawi, Said F ^a,b   Abbott, Derek ^a,b   Franzon, Paul D ^a,c  

^a IEEE   (Australia)

^b UNIVERSITY OF ADELAIDE   (Australia)

^c North Carolina State University   (United States)

Author keywords

3 D MCM technology; 3 D packaging; Bare dice stacking; MCM stacking; Vertical interconnection

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; MULTICHIP MODULES; VLSI CIRCUITS;

BARE DICE STACKING; THREE DIMENSIONAL PACKAGING; VERTICAL INTERCONNECTION TECHNIQUES;

ELECTRONICS PACKAGING;

EID: 0032002771     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.659500     Document Type: Review

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