Stacking technology for a space constrained microsystem

Journal of Intelligent Material Systems and Structures

Volumn 9, Issue 9, 1998, Pages 749-754

  Heschel, M ^a   Kuhmann, J F ^a   Bouwstra, S ^a   Amskov, M ^b  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b DELTA Danish Electronics Light & Acoustics   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; SOLDERING; TRANSDUCERS;

ELECTRICAL INTERCONNECTS; INTELLIGENT TRANSDUCERS;

MICROELECTROMECHANICAL DEVICES;

EID: 0344641964     PISSN: 1045389X     EISSN: None     Source Type: Journal    
DOI: 10.1177/1045389X9800900907     Document Type: Article

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