Integration of through-wafer interconnects with a two-dimensional cantilever array

Sensors and Actuators, A: Physical

Volumn 83, Issue 1, 2000, Pages 118-123

  Chow, E M ^a   Soh, H T ^a   Lee, H C ^a   Adams, J D ^a   Minne, S C ^a   Yaralioglu, G ^a   Atalar, A ^a   Quate, C F ^a   Kenny, T W ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; ASPECT RATIO; MICROMACHINING; MICROSCOPES; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS;

PIEZORESISTIVE DEFLECTION SENSORS; PIEZORESISTIVE SILICON CANTILEVERS; SCANNING PROBE MICROSCOPES; THROUGH-WAFER INTERCONNECTS;

MICROSENSORS;

EID: 0033733656     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00381-7     Document Type: Article

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