Characterization of a two-dimensional cantilever array with through-wafer electrical interconnects

Applied Physics Letters

Volumn 80, Issue 4, 2002, Pages 664-666

  Chow, Eugene M ^a   Yaralioglu, Goksen G ^a   Quate, Calvin F ^a   Kenny, Thomas W ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPES; CANTILEVER ARRAYS; DEFLECTION SENSORS; ELECTRICAL INTERCONNECTS; MICROMACHINED SILICON; ORDERS OF MAGNITUDE; PIEZO-RESISTIVE; SCANNING PROBE ARRAY;

ATOMIC FORCE MICROSCOPY; NANOCANTILEVERS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; TUNGSTEN;

TWO DIMENSIONAL;

EID: 40049092242     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1435804     Document Type: Article

References (12)

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