Via hole technology for microstrip transmission lines and passive elements on high resistivity silicon

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1999, Pages 581-584

  Strohm, K M ^a   Nuechter, P ^a   Rheinfelder, C N ^a   Guehl, R ^a  

^a DAIMLER AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATTENUATION; COMPUTER SIMULATION; ELECTRIC CONDUCTIVITY; ETCHING; METALLIZING; PERMITTIVITY; RESONATORS; SEMICONDUCTING SILICON;

ADVANCED SILICON ETCH; RING RESONATOR; THERMAL OXIDE; VIA HOLE ETCHING;

MICROSTRIP LINES;

EID: 0033361875     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)