Wafer through-hole interconnections with high vertical wiring densities

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 4, 1996, Pages 516-521

  Christensen, Carsten ^a,b   Kersten, Peter ^c   Henke, Sascha ^b   Bouwstra, Siebe ^b  

^a IEEE

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^c Photo Print Electronic GmbH   (Germany)

Author keywords

Electrodeposited photoresist; Feedthroughs; Flip chip; Microsystems; Multi chip modules

Indexed keywords

ELECTRODEPOSITION; ETCHING; FLIP CHIP DEVICES; MICROELECTROMECHANICAL DEVICES; MULTICHIP MODULES; PHOTORESISTS; SEMICONDUCTING SILICON; SUBSTRATES; ULTRAVIOLET RADIATION;

METALLIC INTERCONNECTION LINES; WAFER THROUGH HOLE INTERCONNECTIONS;

WSI CIRCUITS;

EID: 0030412556     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.554933     Document Type: Article

References (9)

1. C. Christensen, P. Kersten, S. Bouwstra, and J. W. Petersen, "Wafer through-hole interconnections for high vertical wiring densities," in Proc. 2nd European Conf. Electron. Packag. Technol. (EuPac'96), Essen, Germany, Jan. 31-Feb. 2, 1996, pp. 81-82.
2. A. Coello-Vera, L. Albo, P. Pipard, and M. Masgrangeas, "High-power 3D MCM-V modules," in Proc. 2nd European Conf. Electron. Packag. Technol. (Eupac'96), Essen, Germany, Jan. 31-Feb. 2, 1996, pp. 88-90.
3. S. Linder, H. Baltes, F. Gnaedinger, and E. Doering, "Fabrication technology for wafer through-hole interconnections and three-dimensional stacks of chips and wafers," in Proc. 7th IEEE Int. Workshop Micro Electro-Mechanical Syst. (MEMS'94), Japan, Jan. 25-28, 1994, pp. 349-354.
4. G. J. Burger, E. J. T. Smulders, J. W. Berenschot, T. S. J. Lammerink, J. H. J. Fluitman, and S. Imai, "High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through," in Proc. Transducers '95 Eurosensors IX, The 8th Int. Conf. Solid-State Sensors Actuators, Eurosensors IX, Sweden, June 25-29, 1995, pp. 573-576.
5. S. Linder, H. Baltes, F. Gnaedinger, and E. Doering, "Photolithography in anisotropically etched grooves," in Proc. 9th IEEE Int. Workshop Micro Electro-Mechanical Syst. (MEMS'96), CA, Feb. 11-15, 1996, pp. 38-43.
6. O. Ehrmann, K. Buschick, G. Chmiel, A. Paredes, V. Glaw, and H. Reichl, "3D multichip modules," in Proc. Int. Conf. Multichip Modules (ICEMCM'95), CO, Apr. 19-21, 1995, pp. 358-363.
7. P. Kersten, S. Bouwstra, and J. W. Petersen, "Photolithography on micromachined 3D surfaces using electrodeposited photoresists," Sensors and Actuators, vol. A51, pp. 51-54, Dec. 1995.
8. Shipley Europe Limited, Herald Way, Coventry, CV3 2RQ U.K.
9. S. M. Sze, Semiconductor Physics, Physics and Technology. New York: Wiley, 1985, p. 431.