High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through

Sensors and Actuators, A: Physical

Volumn 54, Issue 1-3, 1996, Pages 669-673

  Burger, G J ^a   Smulders, E J T ^a   Berenschot, J W ^a   Lammerink, T S J ^a   Fluitman, J H J ^a   Imai, S ^b  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b HITACHI LTD   (Japan)

Author keywords

Contacting; Feed throughs; Micromachining; Patterning; Shadow masks

Indexed keywords

EID: 0000034944     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)80035-0     Document Type: Article

References (6)

1. R. Glang and L.V. Gregor, Generation of patterns in thin films, Handbook of Thin-film Technology, McGraw-Hill, New York, 1970, pp. 7-1-7-10.
2. S. Gray and P.K. Weimer, Production of fine patterns by evaporation, RCA Review, 20 (1959) 413-425.
3. H.V. Jansen, M.J. de Boer, R. Legtenberg and M. Elwenspoek, The black silicon method: a universal method for determining the parameter setting of a fluorine-based reactive ion etcher in deep silicon trench etching with profile control, Proc. MME '94, Pisa, Italy, 1994, pp. 60-64.
4. M. Esashi, Micromachining for packaged sensors, Proc. 7th Int. Conf. Solid-State Sensors and Actuators (Transducers '93), Yokohama, Japan, 7-10 June, 1993, pp. 260-265.
5. S. Linder, H. Baltus, F. Gnaedinger and E. Doering, Fabrication technology for wafer through-hole interconnections and three-dimensional stacks of chips and wafers, Proc. 7th IEEE Workshop on Micro Electro Mechanical Systems, MEMS '94, Oiso, Japan, January, 1994, pp. 349-354.
6. E.J.T. Smulders, to be published.