Semiconductor wafer bonding

Annual Review of Materials Science

Volumn 28, Issue 1, 1998, Pages 215-241

  Gosele U ^a   Tong, Q Y ^b  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b Duke University   (United States)

Author keywords

Compliant substrate; Silicon on insulator; Surface energy; UHV bonding

Indexed keywords

ACTUATORS; BONDING; INTERFACES (MATERIALS); OPTICAL DEVICES; SILICON ON INSULATOR TECHNOLOGY; SILICON SENSORS; VACUUM APPLICATIONS; VAN DER WAALS FORCES;

WAFER BONDING;

SILICON WAFERS;

EID: 0031624240     PISSN: 00846600     EISSN: None     Source Type: Journal    
DOI: 10.1146/annurev.matsci.28.1.215     Document Type: Article

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