History and future of semiconductor wafer bonding

Solid State Phenomena

Volumn 47-48, Issue , 1996, Pages 33-44

  Gosele U ^a   Stenzel, H ^a   Reiche, M ^a   Martini, T ^a   Steinkirchner, H ^a   Tong, Q Y ^b  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b Duke University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; SILICON WAFERS;

BONDING STRENGTH; HISTORY AND FUTURE; PRESENT STATUS; SEMI-CONDUCTOR WAFER;

WAFER BONDING;

EID: 4243658015     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Article

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