Back-to-back substrate wafer bonding: A new approach to the fabrication of double-side coated wafers

Applied Physics A: Materials Science and Processing

Volumn 64, Issue 2, 1997, Pages 211-212

  Kopperschmidt, P ^a   Kastner G ^a   Hesse, D ^a   Gosele U M ^a   Lorenz, M ^b  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b UNIVERSITY OF LEIPZIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL LATTICES; FABRICATION; GOLD; HEAT TREATMENT; METALLIC FILMS; SAPPHIRE; TRANSMISSION ELECTRON MICROSCOPY; YTTRIUM COMPOUNDS;

DIRECT WAFER BONDING; GOLD FILM; PULSED LASER DEPOSITION; SAPPHIRE WAFER;

LASER ABLATION;

EID: 0031073483     PISSN: 09478396     EISSN: None     Source Type: Journal    
DOI: 10.1007/s003390050467     Document Type: Article

References (8)

1. Z.-Y. Shen: In High-Temperature Super-conducting Microwave Circuits, (Artech House, Inc., London 1994), p. 103
2. F. C. Wellstood, J. J. Kingston and J. Clarke: J. Appl. Phys. 75, 683 (1994)
3. P. Kopperschmidt, G. Kästner, D. Hesse und U. M. Gösele, Proc. 5. Statusseminar Supraleitung und Tieftemperaturphysik. VDI Technology Center, Cologne, (June 1996), in press
4. S. Bengtsson: J. Electronic Materials 21, 669 (1992)
5. C. Hunt, H. Baumgart, S. Iyer, U. Gösele, T. Abe (eds.): Proc. 3rd Int. Symp. Semiconductor Wafer Bonding: Science, Technology and Applications (Electrochem. Soc., Pennington, NJ 1995) Proc. Vol. 95-7
6. J. Haisma, G. A. C. M. Spierings, T. M. Michielsen, C. L. Adema: Philips. J. Res. 49, 23 (1995)
7. W. Maszara, G. Goetz, A. Caviglia, J. B. McKnitterick: J. Appl. Phys. 64, 2987 (1986)
8. C. B. Eom, L. Huang, R A. Rao, Q. Y. Tong, U. Gösele: IEEE Trans. Appl. Superconductivity (August 1996), in press