Improved heat dissipation and optical performance of high-power LED packaging with sintered nanosilver die-attach material

International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Global Business Council, GBC 2010 Spring Conference

Volumn 2, Issue , 2010, Pages 1383-1409

  Panaccione, Paul ^a   Wang, Tao ^b,c   Chen, Xu ^c   Luo, Susan ^d   Lu, Guo Quan ^b  

^a Luminus Devices Inc   (United States)

^b MC 0106   (United States)

^c TIANJIN UNIVERSITY   (China)

^d NBE Technologies   (United States)

Author keywords

Die attach; LED; Nano silver

Indexed keywords

CHEMICAL MECHANISM; DIE-ATTACH; DIE-ATTACH MATERIALS; HIGH-POWER LIGHT-EMITTING DIODES; JUNCTION TEMPERATURES; NANO SILVER; OPTICAL PERFORMANCE; THERMAL PERFORMANCE;

CHIP SCALE PACKAGES; CROSSLINKING; DIES; EXHIBITIONS; FLIP CHIP DEVICES; LUMINANCE; PHOTOMETRY; SILVER; SINTERING; SUBSTRATES;

LIGHT EMITTING DIODES;

EID: 84880047553     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)

1. Crane, C.H., D. T. Lovell, W. A. Baginski, and M. G. Olsen, Diffusion welding of dissimilar metals. Welding Res. Supp., 1967. 46: p. 23-31.
2. O'Brian, M, C. R. Rice, and D. L. Olsen, High strength diffusion welding of silver coated base metals. Weld. J., 1976. 55(1): p. 25-27.
3. Scheuermann, U., Low Temperature Joining Technology - A High Reliability Alternative to Solder Contacts, in Workshop on Metal Ceramic Composites for Functional Application. 1997: Vienna.
4. Schwarzbauer, H., and Kuhnert, R., Novel large area joining technique for improved power device performance. IEEE Trans. Ind. Appl, 1991. 27: p. 93-95.
5. Amro, R, J. Lutz, J. Rudzki, R. Sittig, and M. Thoben. Power Cycling at High Temperature Swings of Modules with Low Temperature Joining Technique, in the 18th International Symposium on Power Semiconductor Devices & LC's. 2006. Naples, Italy.
6. Zhang, Z., and G-Q. Lu, Pressure-Assisted Low-Temperature Sintering of Silver Paste as an Alternative Die-Attach Solution to Solder Reflow IEEE Transactions on Electronics Packaging Manufacturing, 2002. 25(4): p. 279-283.
7. Scheuermann, U., and P. Beckedahl, The Road to the Next Generation Power Module - 100% Solder free Design, in The 5th International Conference on Integrated Power Electronics Systems (C1PS 2008). 2008: Nuremberg, Germany.
8. Scheuermann, U., Reliability challenges of automotive power electronics. Microelectronics Reliability, 2009. 49: p. 1319-1325.
9. Bai, J.G., and G-Q. Lu, Thermomechanical Reliability of Low-Temperature Sintered Silver Die-Attached SiC Power Device Assembly. IEEE Trans, on Device and Materials Reliability, 2006. 6(3): p. 436-441.
10. Bai, J.G., Z. Z. Zhang, J. N. Calata, and G-Q. Lu, Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material. IEEE Transactions on Components and Packaging Technologies 2006. 29(3): p. 589-593.
11. Zhang, Z., J. N. Calata, J. G. Bai, and G-Q. Lu. Nanoscale Silver Sintering for High-Temperature Packaging of Semiconductor Devices, in Proc. of 2004 TMS Annual Meeting & Exhibition. 2004. Charlotte, NC.
12. Bai, J.G., J. N. Calata, G Lei, Z. Zhang and G-Q. Lu. Thermomechanical Reliability of Sintered Silver Die-attachment, in the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM). 2006. San Diego, CA.
13. G B. Stringfellow and M. G Craford, "High Brightness Light Emitting Diodes: Volume 48", Academic Press, 1997.
14. S. Naritsuka, Y. Nishikawa, H. Sugawara, M. Ishikawa and Y. Kokubun, "Studies on InGaAlP Layers Grown by Low-Pressure Metalorganic Chemical Vapor Deposition Photoluminescence,", Journal of Electronic Materials, 1991, vol. 20, No. 9.
15. J.G. Liu et al, "Chip-on-Board Packaging and Thermal Solutions for 100W Single Large Area LED," IMAPS 5th International Conference and Exhibition on Device Packaging, Scottsdale AZ, March 9-12, 2009.
16. A.A. Erchak et al, "Patterned Light Emitting Devices," US Patent, US7, 345, 416 B2. Mar. 18, 2008
17. R. Karlicek, "Photonic Lattice LEDs are New Class of Light-Emitting Device," LEDs Magazine, July/August, pp 20-23, 2007.
18. A.A. Erchak et al, "Enhanced Coupling to Vertical Radiation Using Two-Dimensional Photonic Crystal in a Semiconductor Light-Emitting Diodes," Appl. Phys. Lett. 78(5), pp. 563-565, 2001.
19. A.A. Erchak, "PhlatLight: the Future of Rear Projection TVs," 4th Annual DisplaySearch HDTV Conf, Aug 2006.
20. C. Hoepfner, "PhlatLight" Photonic Lattice LEDs for RPTV Light Engines," SID Symposium Technical Papers, Vol. 37, pp. 1808-1811, 2006.
21. J. E. Sergent and A. Krum, "Thermal Management Handbook for Electronic Assemblies," McGraw-Hill, New York, 1998.
22. M. Denninger, "A General Solution Framework for LED Cooling Problems," IMAPS New England 35th Symposium and Expo, Boxborough, MA, 2008.
23. R. Karlicek, J. Graff, and D. Sciabica, "Thermal Design Considerations for High-Power Single-Chip LEDs," LEDs Magazine, January/February pp 40-43, 2008.