Effect of interconnection area on shear strength of sintered joint with nano-silver paste

Soldering and Surface Mount Technology

Volumn 20, Issue 1, 2008, Pages 8-12

  Qi, Kun ^a   Chen, Xu ^a   Lu, Guo Quan ^b  

^a TIANJIN UNIVERSITY   (China)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

Shear strength; Sintering

Indexed keywords

ELECTRONICS PACKAGING; MICROELECTRONICS; NANOSTRUCTURED MATERIALS; SHEAR STRENGTH; SINTERING; SOLDERED JOINTS;

HIGH-TEMPERATURE PACKAGING; INTERCONNECTION QUALITY; NANO-SILVER PASTE; WIDE-BANDGAP SEMICONDUCTORS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 40249119794     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910810861431     Document Type: Article

References (8)

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