Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging

Journal of Materials Science: Materials in Electronics

Volumn 26, Issue 3, 2015, Pages 1858-1865

  Wu, R W ^a   Tsao, L C ^b   Chen, R S ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ANALYSIS; ACTIVATION ENERGY; COPPER; GROWTH KINETICS; INTERMETALLICS; ISOTHERMS; LEAD-FREE SOLDERS; OXIDE MINERALS; SILVER ALLOYS; SILVER METALLOGRAPHY; TERNARY ALLOYS; TIN ALLOYS; TIN METALLOGRAPHY; TITANIUM ALLOYS; TITANIUM DIOXIDE; TITANIUM METALLOGRAPHY;

APPARENT ACTIVATION ENERGY; COMPOSITE SOLDERS; DIFFUSION-CONTROLLED PROCESS; IMAGING SOFTWARE; INTERMETALLIC GROWTH; ISOTHERMAL AGING; KINETICS ANALYSIS; SEM MICROGRAPHS;

COPPER METALLOGRAPHY;

EID: 84925502911     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-014-2621-8     Document Type: Article

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