SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 88, Issue 9, 2011, Pages 2964-2969

Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate

(3) Tsao, L C a Chu, C P a Peng, S F a

a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

Author keywords

Kinetics analysis; Sn3.5Ag0.5Cu composite solder; TiO2 nanopowder

Indexed keywords

COMPOSITE ALLOYS; COMPOSITE SOLDERS; CU SUBSTRATE; CU-SN INTERMETALLICS; DIFFUSION CONTROLLED; ELECTRICAL COMPONENTS; IMAGING SOFTWARE; INTERFACIAL INTERMETALLICS; INTERFACIAL MICROSTRUCTURE; KINETICS ANALYSIS; LEAD-FREE; NANO POWDERS; PROCESSING CONDITION; SCALLOP-SHAPED; SCANNING ELECTRON MICROSCOPES; SEM MICROGRAPHS; SOLDERING REACTIONS; TIO;

ACTIVATION ANALYSIS; ACTIVATION ENERGY; GROWTH KINETICS; INTERMETALLICS; KINETICS; NANOSTRUCTURED MATERIALS; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; TIN; TITANIUM DIOXIDE;

COPPER ALLOYS;

EID: 80051548583 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2011.04.034 Document Type: Article

Times cited : (41)

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