Structural characterization and creep resistance of nano-silicon carbide reinforced Sn-1.0Ag-0.5Cu lead-free solder alloy

Materials and Design

Volumn 55, Issue , 2014, Pages 837-845

  El Daly, A A ^a   Al Ganainy, G S ^b   Fawzy, A ^b   Younis, M J ^c  

^a Zagazig University   (Egypt)

^b Ain Shams University   (Egypt)

^c ISLAMIC UNIVERSITY OF GAZA   (Palestine)

Author keywords

Lead free solder; Mechanical properties; Microstructure

Indexed keywords

BALL MILLING; CREEP; CREEP RESISTANCE; MECHANICAL PROPERTIES; MICROSTRUCTURE; PARTICLE REINFORCED COMPOSITES; PARTICLE SIZE; REINFORCEMENT; SILICON CARBIDE; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS;

FINE MICROSTRUCTURE; HIGH-ENERGY BALL MILLING; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; NANO-SIZED PARTICLES; SIC NANO-PARTICLES; SOLDERING PROCESS; STRUCTURAL CHARACTERIZATION;

TIN;

EID: 84887538987     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2013.10.043     Document Type: Article

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