Reaction kinetics of Ni/Sn soldering reaction

Acta Materialia

Volumn 58, Issue 9, 2010, Pages 3187-3197

  Görlich, Jens ^a   Baither, Dietmar ^a   Schmitz, Guido ^a  

^a UNIVERSITY OF MÜNSTER   (Germany)

Author keywords

Grain boundary diffusion; Grain boundary wetting; Intermetallic compounds; Phase transformation; Soldering reaction

Indexed keywords

GRAIN-BOUNDARY DIFFUSION; GRAIN-BOUNDARY WETTING; INTERMETALLIC COMPOUNDS; PHASE TRANSFORMATION; SOLDERING REACTIONS;

FLIP CHIP DEVICES; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GROWTH KINETICS; PHASE INTERFACES; RATE CONSTANTS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SOLDERING; TIN; TRANSMISSION ELECTRON MICROSCOPY; WETTING;

REACTION KINETICS;

EID: 77950087611     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.01.027     Document Type: Article

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