Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn-3.0Ag-0.5Cu-xTiO2 composite solder

Materials and Design

Volumn 55, Issue , 2014, Pages 574-582

  Tang, Y ^a,b   Li, G Y ^b   Pan, Y C ^b  

^a ZHONGKAI UNIVERSITY OF AGRICULTURE AND ENGINEERING   (China)

^b SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Lead free composite solder; Microhardness; Microstructure; Nanoparticles; Tensile properties

Indexed keywords

ALLOYS; ENERGY DISPERSIVE SPECTROSCOPY; MICROHARDNESS; MICROSTRUCTURE; NANOPARTICLES; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TENSILE PROPERTIES; TENSILE STRENGTH; TENSILE TESTING; TITANIUM DIOXIDE; X RAY DIFFRACTION ANALYSIS;

COMPOSITE SOLDERS; DISPERSION STRENGTHENING; ENERGY DISPERSIVE X-RAY SPECTROSCOPY; MICROSTRUCTURAL CHANGES; SOLID SOLUTION HARDENING; SURFACE FREE ENERGY; ULTIMATE TENSILE STRENGTH; WEIGHT PERCENTAGES;

TIN;

EID: 84886996642     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2013.10.033     Document Type: Article

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