Corrosion characterization of Cu-Sn intermetallics in 3.5wt.% NaCl solution

Corrosion Science

Volumn 63, Issue , 2012, Pages 393-398

  Tsao, L C ^a   Chen, C W ^b  

^a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

A. Cu 3Sn; A. Cu 6Sn 5; B. Corrosion; B. NaCl solution

Indexed keywords

A. CU 6SN 5; BREAKDOWN POTENTIAL; CO-EXISTING; CORROSION BEHAVIOR; CORROSION CHARACTERIZATION; CORROSION CURRENT DENSITIES; CORROSION POTENTIALS; CORROSION PRODUCTS; CU CONTENT; CU-SN INTERMETALLICS; GALVANIC CORROSION; NACL SOLUTION; POLARIZATION CURVES; POLARIZATION METHOD;

COPPER COMPOUNDS; CORROSION; INTERMETALLICS; POLARIZATION; SODIUM CHLORIDE;

TIN;

EID: 84864305641     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.corsci.2012.06.015     Document Type: Article

References (39)

1. Tsao L.C., Chang S.Y., Lee C.I., Sun W.H., Huang C.H. Mater. Des. 2010, 31:4831-4835.
2. Tsao L.C., Chang S.Y. Mater. Des. 2010, 31:990-993.
3. Chuang T.H., Wu M.W., Chang S.Y., Ping S.F., Tsao L.C. J. Mater. Sci.: Mater. Electron. 2011, 22:1021-1027.
4. International Technology Roadmap for Semiconductors-Assembly and Packaging, 2009 ed. (). http://www.itrs.net/Links/2009ITRS/2009Chapters_2009Tables/2009_Assembly.pdf.
5. Cho S.W., Han K., Yi Y., Kang S.J., Yoo K.H., Jeong K., Whang C.N. Adv. Eng. Mater. 2006, 8:111-114.
6. Tu K.N., Thompson R.D. Acta Metall. 1982, 30:947-952.
7. Tsao L.C. J. Alloy. Compd. 2011, 509:2326-2333.
8. Tsao L.C. J. Alloy. Compd. 2011, 509:8441-8448.
9. Tsao L.C., Chu C.P., Peng S.F. Microelectron. Eng. 2011, 88:2964-2969.
10. Frear D.R., Vianco P.T. Metall. Mater. Trans. 1994, 25A:1509-1523.
11. Jang G.Y., Lee J.W., Duh J.G. J. Electron. Mater. 2004, 33:1103-1110.
12. Rhee H., Lucas J.P., Subramanian K.N. J. Mater. Sci.: Mater. Electron. 2002, 13:477-484.
13. Deng X., Koopman M., Chawla N., Chawl K.K. Mater. Sci. Eng., A 2004, 364:240-243.
14. F. Song, S. W. Ricky Lee, 56th Electronic Components & Technology. Conference (ECTC), 2006, pp. 891-898.
15. Jellesen M.S., Minzari D., Møller P., Ambat R. Corrosion in electronics (Paper presented at 2008 Eurocorr Conference) September 2008, Edinburgh, Scotland, pp. 7-11.
16. L.C. Tsao, Corrosion resistance of Pb-free and novel nano-composite solders in electronic packaging, Corrosion Resistance, 107-132.
17. Chidambaram V., Hald J., Ambat R., Hattel J. JOM 2009, 61:59-65.
18. Saunders N., Miodownik A.P. Bulk Alloy Phase Diagrams 1990, 11:278-287.
19. L.C. Tsao, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), (2009) 1164-1166.
20. JCPDS45-1488, International Center for Powder Diffraction Data, Swarthmore, PA.
21. JCPDS65-4653, International Center for Powder Diffraction Data, Swarthmore, PA.
22. Brooks P.L., Gillam E. Acta Metall. 1970, 18:1181-1185.
23. Tafel J., Physik Z. Chem. 1905, 50:6661.
24. Deslouis C., Mengoli G., Musiani M.M., Tribollet B. J. Appl. Electrochem. 1988, 18:374-383.
25. Feng Y., Teo W.-K., Siow K.-S., Tan K.-L., Hsieh A.-K. Corros. Sci. 1996, 38:369-385.
26. Debiemme-Chouvy* C., Ammeloot F., Sutter E.M.M., Tan K.-L., Hsieh A.-K. Appl. Surf. Sci. 2001, 174:55-61.
27. Robbiola L., Pereira N., Thaury K., Fiaud C., Labbeâ J.P. in: Proceedings of the International Conference on Metals Conservation, Metal 98 1998, France, Draguignan, p. 136.
28. Wang Y.Z., Beccaria A.M., Poggi G. Corros. Sci. 1994, 36:1277-1288.
29. Oulfajrite H., Sabbar A., Boulghallat M., Jouaiti A., Lbibb R., Zrinch A. Mater. Lett. 2003, 57:4368-4371.
30. Kapusta S.D., Hackerman N. Anodic passivation of tin in slightly alkaline solutions. Electrochim. Acta 1980, 25:1625-1639.
31. D. Q. Yu, C. M. L. Wu, L. Wang, 16th International Corrosion Congress, Beijing, P.R. China, (2005) 19-24.
32. Li D., Liu P.P.C.C. Corros. Sci. 2008, 50:995-1004.
33. Rosalbino F., Angelini E., Zanicchi G., Carlini R., Marazza R. Electrochim. Acta 2009, 54:7231-7235.
34. Kear G., Barker B.D., Walsh F.C. Corros. Sci. 2004, 46:109-135.
35. Deslouis C., Tribollet B., Mengoli G., Musiani M.M. J. Appl. Electrochem. 1988, 18:374-393.
36. Souissi N., Sidot E., Bousselmi L., Triki E., Robbiola L. Corros. Sci. 2007, 49:3333-3347.
37. JCPDS 82-2114, International Center for Powder Diffraction Data, Swarthmore, PA.
38. Lin J.H.C., Marshall G.W., Marshall S.J. J. Dent. Res. 1983, 62:112-115.
39. Sutow E.J., Jones D.W., Hall G.C., Owen C.G. J. Dent. Res. 1991, 70:1082-1087.