Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders

Microelectronics Reliability

Volumn 54, Issue 5, 2014, Pages 945-955

  Gain, Asit Kumar ^a   Chan, Y C ^b  

^a UNIVERSITY OF NEW SOUTH WALES   (Australia)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; HARDNESS; MICROSTRUCTURE; NANOPARTICLES; SILVER; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS; ZIRCONIUM ALLOYS;

CERAMIC NANOPARTICLES; COMPOSITE SOLDER JOINTS; COMPOSITE SOLDERS; DAMPING CHARACTERISTICS; DISLOCATION DENSITIES; FINE MICROSTRUCTURE; GROWTH MECHANISMS; REFINED MICROSTRUCTURE;

TIN;

EID: 84899911860     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2014.01.026     Document Type: Article

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