Development of seed layer for electrodeposition of copper on carbon nanotube bundles

Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics

Volumn 33, Issue 2, 2015, Pages

  Jordan, Matthew B ^a   Feng, Ying ^b   Burkett, Susan L ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b University of Alabama   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COATINGS; CARBON; CARBON NANOTUBES; CATALYSTS; CHEMICAL VAPOR DEPOSITION; COPPER; DEPOSITION; ELECTROCHEMICAL SENSORS; ELECTRODEPOSITION; ELECTRONICS PACKAGING; ETHYLENE; INDUCTIVELY COUPLED PLASMA; MECHANICAL PROPERTIES; METHANE; OXIDE FILMS; REDUCTION; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON; SILICON WAFERS; THREE DIMENSIONAL INTEGRATED CIRCUITS; TUNGSTEN; YARN;

CARBON NANOTUBE BUNDLE; CONVENTIONAL MATERIALS; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTROCHEMICAL DEPOSITION; HIGH CURRENT DENSITIES; SEMICONDUCTOR INDUSTRY; THERMAL CHEMICAL VAPOR DEPOSITION; THROUGH SILICON VIAS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84923687865     PISSN: 21662746     EISSN: 21662754     Source Type: Journal    
DOI: 10.1116/1.4907164     Document Type: Article

References (41)

1. P. Garrou, C. Bower, and P. Ramm, Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits, 1st ed. (Wiley-VCH, Weinheim, Germany, 2008).
2. C. Hau-Riege and R. Klein, Reliability Physics Symposium (IEEE, Phoenix, AZ, 2008), pp. 377-380.
3. I. Dutta, P. Kumar, and M. S. Bakir, JOM 63, 70 (2011). 10.1007/s11837-011-0179-y
4. T. Frank et al., Microelectron. Reliab. 53, 17 (2013). 10.1016/j.microrel.2012.06.021
5. H. Li, C. Xu, N. Srivastava, and K. Banerjee, IEEE Trans. Electron Devices 56, 1799 (2009). 10.1109/TED.2009.2026524
6. Y. Chai, K. Zhang, M. Zhang, P. C. H. Chan, and M. M. F. Yuen, Proceedings of the Electronic Components and Technology Conference (IEEE, Lake Buena Vista, FL, 2007), pp. 1224-1229.
7. C. Subramaniam, T. Yamada, K. Kobashi, A. Sekiguchi, D. N. Futaba, M. Yumura, and K. Hata, Nat. Commun. 4, 1 (2013). 10.1038/ncomms3202
8. T. Xu, Z. Wang, J. Miao, X. Chen, and C. M. Tan, Appl. Phys. Lett. 91, 042108 (2007). 10.1063/1.2759989
9. T. Wang, K. Jeppson, N. Olofsson, E. B. Campbell, and J. Liu, Nanotechnology 20, 485203 (2009). 10.1088/0957-4484/20/48/485203
10. T. Wang, K. Jeppson, L. Ye, and J. Liu, Small 7, 2313 (2011). 10.1002/smll.201100615
11. R. Xie, C. Zhang, M. H. van der Veen, K. Arstila, T. Hantschel, B. Chen, G. Zhong, and J. Robertson, Nanotechnology 24, 125603 (2013). 10.1088/0957-4484/24/12/125603
12. F. Kreupl, A. P. Graham, M. Liebau, G. S. Duesberg, R. Seidel, and E. Unger, Proceedings of the International Electron Devices Meeting (IEEE, San Francisco, CA, 2004), pp. 683-686.
13. L. Aryasomayajula and K. J. Wolter, J. Nanotechnol. 2013, 296517. 10.1155/2013/296517
14. T. Chowdhury and J. F. Rohan, " Carbon nanotube composites for electronic interconnect applications," in Syntheses and Applications of Carbon Nanotubes and Their Composites, edited by S. Suzuki (InTech, Rijeka, Croatia, 2013).
15. T. Wang, S. Chen, D. Jiang, Y. Fu, K. Jeppson, L. Ye, and J. Liu, IEEE Electron Device Lett. 33, 420 (2012). 10.1109/LED.2011.2177804
16. Y. Chai, P. C. H. Chan, Y. Fu, Y. C. Chuang, and C. Y. Liu, Proceedings of the Electronic Components and Technology Conference (IEEE, Reno, NV, 2008), pp. 412-420.
17. S. L. Burkett, X. Qiao, D. Temple, B. Stoner, and G. McGuire, J. Vac. Sci. Technol., B 22, 248 (2004). 10.1116/1.1642643
18. J. Charbonnier et al., Proceedings of the European Microelectronics Packaging Conference (IEEE, Grenoble, France, 2013), pp. 1-6.
19. L. Djomeni et al., Microelectron. Eng. 120, 127 (2014). 10.1016/j.mee.2013.11.010
20. C. W. Tang, H. T. Young, and K. M. Li, J. Micromech. Microeng. 22, 045019 (2012). 10.1088/0960-1317/22/4/045019
21. F. Laermer and A. Schilp, U.S. patent 5,501,893 (26 March 1996).
22. A. F. Isakovic, K. Evans-Lutterodt, D. Elliott, A. Stein, and J. B. Warren, J. Vac. Sci. Technol., A 26, 1182 (2008). 10.1116/1.2960557
23. I. U. Abhulimen, T. Lam, A. Kamto, S. Burkett, L. Schaper, and L. Cai, IEEE Region 5 Technical Conference (IEEE, Fayetteville, AR, 2007), pp. 102-104.
24. A. Kamto, R. Divan, A. V. Sumant, and S. L. Burkett, J. Vac. Sci. Technol., A 28, 719 (2010). 10.1116/1.3281005
25. D. S. Tezcan, K. D. Munck, N. Pham, O. Luhn, A. Aarts, P. D. Moor, K. Baert, and C. V. Hoof, Proceedings of the Electronic Components and Technology Conference (IEEE, San Diego, CA, 2006), pp. 22-28.
26. D. S. Tezcan, N. Pham, B. Majeed, P. D. Moor, W. Ruythooren, and K. Baert, Proceedings of the Electronic Components and Technology Conference (IEEE, Reno, NV, 2007), pp. 643-647.
27. R. Li, Y. Lamy, W. F. A. Besling, F. Roozeboom, and P. M. Sarro, J. Micromech. Microeng. 18, 125023 (2008). 10.1088/0960-1317/18/12/125023
28. A. Kamto, Y. Liu, L. Schaper, and S. L. Burkett, Thin Solid Films 518, 1614 (2009). 10.1016/j.tsf.2009.07.151
29. S. Spiesshoefer et al., J. Vac. Sci. Technol., A 24, 1277 (2006). 10.1116/1.2206193
30. T. Rowbotham, J. Patel, T. Lam, I. Abhulimen, S. Burkett, L. Cai, and L. Schaper, J. Vac. Sci. Technol., B 24, 2460 (2006). 10.1116/1.2221313
31. M. J. Wolf, T. Dretschkow, B. Wunderle, N. Jurgensen, G. Englemann, O. Ehrmann, A. Uhlig, B. Michel, and H. Reichl, Proceedings of the Electronic Components and Technology Conference (IEEE, Lake Buena Vista, FL, 2008), pp. 563-570.
32. K. Weiss, S. Riedel, S. E. Schulz, M. Schwerd, H. Helneder, H. Wendt, and T. Gessner, Microelectron. Eng. 50, 433 (2000). 10.1016/S0167-9317(99)00312-3
33. H. Y. Li, E. Liao, X. F. Pang, H. Yu, X. X. Yu, and J. Y. Sun, Proceedings of the Electronic Components and Technology Conference (IEEE, Las Vegas, NV, 2010), pp. 777-780.
34. P. Ramm, M. J. Wolf, A. Klumpp, R. Wieland, B. Wunderle, B. Michel, and H. Reichl, Proceedings of the Electronic Components and Technology Conference (IEEE, Lake Buena Vista, FL, 2008), pp. 841-846.
35. S. Esconjauregui, C. M. Whelan, M. Caroline, and K. Maex, Carbon 47, 659 (2009). 10.1016/j.carbon.2008.10.047
36. F. Banhart, Nanoscale 1, 201 (2009). 10.1039/b9nr00127a
37. J. Robertson, Mater. Today 10, 36 (2007). 10.1016/S1369-7021(06)71790-4
38. Y. Li, W. Kim, Y. Zang, M. Rolandi, D. Wang, and H. Dai, J. Phys. Chem. B 105, 11424 (2001). 10.1021/jp012085b
39. M. F. L. De Volder, S. J. Park, S. H. Tawfick, D. O. Vidaud, and A. J. Hart, J. Micromech. Microeng. 21, 045033 (2011). 10.1088/0960-1317/21/4/045033
40. Y. Feng and S. L. Burkett, " Fabrication and electrical performance of through silicon via interconnects filled with a copper/carbon nanotube composite," J. Vac. Sci. Technol. (accepted).
41. T. Lam, " Electroplating and reactive sputtering for TSV applications," Master's thesis (University of Arkansas, 2006).