The effect of a width transition on the electromigration reliability of Cu interconnects

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2008, Pages 377-380

  Hau Riege, Christine ^a   Klein, Rich ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CU INTERCONNECTS; MEDIAN TIME-TO-FAILURE; RELIABILITY PHYSICS;

ATOMIC PHYSICS; ATOMS; COPPER; ELECTROMIGRATION; MACHINE DESIGN; OPTICAL INTERCONNECTS; RISK ASSESSMENT; RISK MANAGEMENT;

RELIABILITY;

EID: 51549118913     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2008.4558915     Document Type: Conference Paper

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