Advanced processing techniques for through-wafer interconnects

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 1, 2004, Pages 248-256

  Burkett, S L ^a   Qiao, X ^b   Temple, D ^c   Stoner, B ^c   McGuire, G ^d  

^a UNIVERSITY OF ARKANSAS   (United States)

^b ATMI   (United States)

^c MCNC   (United States)

^d ITC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPPER PLATING; DIELECTRIC MATERIALS; ELECTRIC INSULATORS; ELECTROPLATING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; METALLORGANIC CHEMICAL VAPOR DEPOSITION; MICROELECTROMECHANICAL DEVICES; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION;

CHEMICAL MECHANICAL PLANARIZATION (CMP); SEED LAYER DEPOSITION; THROUGH-WAFER INTERCONNECTS;

SILICON WAFERS;

EID: 1642369517     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1642643     Document Type: Conference Paper

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