Copper/carbon nanotube composite interconnect for enhanced electromigration resistance

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 412-420

  Chai, Yang ^a   Chan, Philip C H ^a   Fu, Yunyi ^a   Chuang, Y C ^b   Liu, C Y ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBES; COMPUTER NETWORKS; COPPER; ELECTRIC RESISTANCE; ELECTROMIGRATION; NANOPORES; NANOSTRUCTURES; NANOTUBES;

ELECTRICAL RESISTIVITIES; ROOM TEMPERATURES;

METALLIC MATRIX COMPOSITES;

EID: 51349158937     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550004     Document Type: Conference Paper

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