Carbon nanotube/copper composites for via filling and thermal management

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1224-1229

  Chai, Yang ^a   Zhang, Kai ^a   Zhang, Min ^a   Chan, Philip C H ^a   Yuen, Matthrew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; ELECTRODES; ELECTROPLATING; SILICA; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL STRESS;

COPPER COMPOSITES; CURRENT CARRYING CAPACITY; ELECTROPLATED COPPER FILLS; SILICON SUBSTRATES; THERMAL INTERFACE MATERIAL;

CARBON NANOTUBES;

EID: 35348906655     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373950     Document Type: Conference Paper

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