SCOPUS 정보 검색 플랫폼

JOM

Volumn 63, Issue 10, 2011, Pages 70-77

Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias

(3) Dutta, I a Kumar, P a Bakir, M S b

a Washington State University (United States)

b GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION FLUXES; INTERCONNECT SYSTEMS; INTERFACIAL SLIDING; INTERFACIAL STRAIN; MICROELECTRONIC PACKAGE; RAPID DIFFUSION; SI CHIPS; THERMOMECHANICAL CYCLING; THROUGH SILICON VIAS;

MICROELECTRONICS;

ELECTROMIGRATION;

EID: 84555202531 PISSN: 10474838 EISSN: 15431851 Source Type: Journal
DOI: 10.1007/s11837-011-0179-y Document Type: Article

Times cited : (46)

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