Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1563-1569

  Lau, John H ^a   Shangguan, Dongkai ^b   Lau, Dennis C Y ^c   Kung, Terry T W ^c   Lee, S W Ricky ^c  

^a AGILENT TECHNOLOGIES   (United States)

^b FLEXTRONICS INTERNATIONAL   (United States)

^c HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP TESTING; ELECTRONIC EQUIPMENT; LEAD; OPTICAL INTERCONNECTS; PRINTED CIRCUIT BOARDS; PROBLEM SOLVING; SOLDERED JOINTS; SOLDERING ALLOYS;

CREEP ANALYSIS; ELECTRONIC PRODUCTS; SOLDER MASK; THERMAL FATIGUE;

CHIP SCALE PACKAGES;

EID: 10444221761     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (26)

1. The European Parliament and the Council of the European Union, "Directive 2002/96/EC on Waste Electrical and Electronic Equipment (WEEE)", Official Journal of the European Union, February 13, 2003, pp. L 37/24-38.
2. The European Parliament and the Council of the European Union, "Directive 2002/95/EC on the Restriction of the Use of Certain Hazardous Substances (RoHS) in Electrical and Electronic Equipment (EEE)", Official Journal of the European Union, February 13, 2003, pp. L 37/24-38.
3. Lau, J., and R. Lee, "Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects", IEEE Proceedings in Photonic Devices and Systems Packaging Symposium, Stanford University, July 2002, pp. 26-30.
4. Lau, J. H., and W. Dauksher, "Creep Constitutive Equations of Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu", International Journal of Micromaterials and Nanomaterials, Issue 03, 2004, pp. 54-62.
5. Lau, J., W. Dauksher, and P. Vianco, "Acceleration Models, Constitutive Equations and Reliability of Lead-Free Solders and Joints," IEEE Electronic Components and Technology Conference Proceedings, New Orleans, Louisiana, June 2003, pp. 229-236.
6. Viance, P., J. Rejent, and A. Kilgo, "Creep Behavior of the Ternary 95.5Sn-3.9Ag-0.6Cu Solder: Part I - As-Cast Condition", to be published in the Journal of Electronics Material.
7. Zhang, Q., A. Dasgupta, and P. Haswell, "Viscoplastic Constitutive Properties and Energy-Partitioning Model of Lead-Free Sn3.9AgO.6Cu Solder Alloy," IEEE Electronic Components and Technology Conference Proceedings, New Orleans, Louisiana, June 2003, pp. 1862-1868.
8. Pang, J. H. L., B. S. Xiong, C. C. Neo, X. R. Zhang, and T. H. Low, "Bulk Solder and Solder Joint Properties for Lead Free 95.5Sn-3.8Ag-0.7Cu Solder Alloy," IEEE Electronic Components and Technology Conference Proceedings, New Orleans, Louisiana, June 2003, pp. 673-679.
9. Pao, Y. H., R. Govila, and E. Jih, "An Experimental and Modeling Study of Thermal Cyclic Behavior of Sn-Cu and Sn-Pb Joints," Proceedings of Materials Science Society Symposium, Vol. 323, 1994, pp. 153-158.
10. Schubert, A., R. Dudek, H. Walter, E. Jung, A. Gollhardt, B. Michel, and H. Reichl, 2002, "Reliability Assessment of Flip-Chip Assemblies with Lead-Free Solder Alloys," IEEE Electronic Components and Technology Conference Proceedings, San Diego, CA, May 2003, pp. 1246-1255.
11. Schubert, A., R. Dudek, E. Auerswald, A. Gollhardt, B. Michel, and H. Reichl, "Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation," IEEE Electronic Components and Technology Conference Proceedings, New Orleans, Louisiana, June 2003, pp. 603-610.
12. Wiese, S., A. Schubert, H. Walter, R. Dudek, F. Feustal, E. Meuesel, and B. Michel, "Constitutive Behavior of Lead-Free Solders vs. Lead-Containing Solders - Experiments on Bulk Specimens and Flip-Chip Joints," IEEE Electronic Components and Technology Conference Proceedings, Orlando, FL, pp. 890-902.
13. th International Symposium on Advanced Packaging Material, 2002, pp. 101-111.
14. Song, H. J., J. W. Morris, and F. Hua, "The Creep Properties of Lead-Free Solder Joints," Journal of Materials, June 2002, pp. 30-32.
15. Hua, F., "Pb-Free Solder Challenges in Electronic Packaging and Assembly," IEEE Electronic Components and Technology Conference Proceedings, New Orleans, Louisiana, June 2003, pp. 58-63.
16. Kanchanomai, C., Y. Miyashita, and Y. Mutoh, "Low Cycle Fatigue Behaviors of Sn-Ag, Sn-Ag-Cu and Sn-Ag-Cu-Bi Lead-Free Solders," Journal of Electronic Materials, Vol. 31, No. 5, pp. 456-465.
17. Lau, J. H., Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, McGraw-Hill, New York, 2000.
18. Smetana, J., R. Horsley, J. Lau, K. Snowdon, D. Shangguan, J. Gleason, I. Memis, D. Love, W. Dauksher, and B. Sullivan, "Design, Materials, and Process for Lead-Free Assembly of High-Density Packages", Soldering & Surface Mount Technology, Vol. 16, No. 1, 2004, pp. 53-62.
19. Lau, J., W. Dauksher, J. Smetana, R. Horsley, D. Shangguan, T. Castello, I. Menis, D. Love, and B. Sullivan, "Design for Lead-Free Solder Joint Reliability of High-Density Packages", Soldering & Surface Mount Technology, Vol. 16, No. 1, 2004, pp. 12-26.
20. Lau, J., N. Hoo, R. Horsley, J. Smetana, D. Shangguan, W. Dauksher, D. Love, I. Menis, and B. Sullivan, "Reliability Testing and Data Analysis of Lead-Free Solder Joints for High-Density Packages'", to be published in Soldering & Surface Mount Technology, Vol. 16, No. 2, 2004.
21. Lau, J., D. Shangguan, T. Castello, R. Horsley, J. Smetana, W. Dauksher, D. Love, I. Menis, and B. Sullivan, "Failure Analysis of Lead-Free Solder Joints for High-Density Packages'", to be published in Soldering & Surface Mount Technology, Vol. 16, No. 2, 2004.
22. Lau, J. H., and Y. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY, 1997.
23. Lau, J. H., Z. Mei, S. Pang, C. Amsden, J. Rayner, and S. Pan, "Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch", ASME Transactions, Journal of Electronic Packaging, Vol. 124, December 2002, pp. 403-410.
24. Lau, J., C. Wong, N. Lee, and R. Lee, Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive Adhesive Materials, McGraw-Hill, New York, NY, 2003.
25. Nguyen, L., N. Kelkar, T. Kao, A. Prabhu, and H. Takiar, "Wafer Level Chip Scale Packaging - Solder Joint Reliability", International Symposium on Microelectronics, San Diego, CA, November 1998, pp. 868-875.
26. Pitarresi, J., S. Chaparala, B. Sammakia, L. Nguyen, V. Patwardhan, L. Zhang, and N. Kelkar, "A Parametric Solder Joint Reliability Model for Wafer Level-Chip Scale Package", IEEE Electronic Components and Technology Conference Proceedings, New Orleans, Louisiana, June 2003, pp. 1323-1328.