Effect of substrate flexibility on solder joint reliability. Part II: Finite element modeling

Microelectronics Reliability

Volumn 45, Issue 1, 2005, Pages 143-154

  Lin, Y C ^a   Chen, X ^a   Liu, Xingsheng ^b,c   Lu, Guo Quan ^a  

^a TIANJIN UNIVERSITY   (China)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^c Science and Technology Center ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; CRACK INITIATION; ENERGY DISSIPATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; THERMOANALYSIS;

FATIGUE FAILURES; FINITE ELEMENT MODELING; FLIP CHIP ON FLEX ASSEMBLY (FCCF); SUBSTRATE FLEXIBILITY;

SOLDERED JOINTS;

EID: 10044289157     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.06.009     Document Type: Article

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