Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments

Materials Science and Engineering: A

Volumn 597, Issue , 2014, Pages 219-224

  Zhang, Liang ^a,b   Han, Ji guang ^a   Guo, Yong huan ^a   He, Cheng wen ^a  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b Engineering IV   (United States)

Author keywords

Creep strain; Fatigue life; Finite element method; Lead free solder

Indexed keywords

BINARY ALLOYS; CERIUM; CERIUM ALLOYS; COPPER ALLOYS; LEAD-FREE SOLDERS; POLYCHLORINATED BIPHENYLS; RARE EARTHS; SILVER ALLOYS; SOLDERED JOINTS; STRAIN ENERGY; TERNARY ALLOYS; THERMAL AGING; THERMAL CYCLING; TIN ALLOYS;

ARRHENIUS; CREEP CONSTITUTIVE MODELS; CREEP STRAIN; CYCLE LOADING; PROPERTY; RARE-EARTHS; SNAGCU SOLDER; SOLDER JOINTS; STRESS/STRAIN; THERMAL;

FINITE ELEMENT METHOD;

EID: 84892659066     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2013.12.098     Document Type: Article

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