Microstructural evolution and tensile properties of Sn-Ag-Cu mixed with Sn-Pb solder alloys

Journal of Alloys and Compounds

Volumn 477, Issue 1-2, 2009, Pages 267-273

  Wang, Fengjiang ^a   O'Keefe, Matthew ^a   Brinkmeyer, Brandon ^a  

^a University of Missouri Rolla   (United States)

Author keywords

Microstructure; Pb contamination; Pb free solder; Sn Ag Cu; Tensile properties

Indexed keywords

EUTECTIC SOLDERS; INTERMETALLIC COMPOUNDS; LENGTH-SCALE; MICROSTRUCTURAL ANALYSIS; PB CONTAMINATION; PB-FREE SOLDER; RICH PHASE; SN-3.0 AG-0.5CU; SN-37PB; SN-AG-CU; SN-PB SOLDERS; SOLDER ALLOYS; SOLDER JOINTS; STRENGTHENING MECHANISMS; TEST SPECIMENS; ULTIMATE TENSILE STRENGTHS;

BRAZING; CERIUM ALLOYS; COPPER ALLOYS; EUTECTICS; INTERMETALLICS; LEAD; LEAD ALLOYS; LEAD COMPOUNDS; MECHANICAL PROPERTIES; MICROSTRUCTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; WELDING;

TIN;

EID: 67349135990     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.10.141     Document Type: Article

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