Finite element modeling predicts the effects of voids on thermal shock reliability and thermal resistance of power device

Welding Journal (Miami, Fla)

Volumn 85, Issue 3, 2006, Pages

  Chang, J ^a,b   Wang, L ^a   Dirk, J ^a   Xie, X ^a,b  

^a DAIMLER AG   (Germany)

^b SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

Equivalent Plastic Strain; Equivalent Stress; Sn Ag Cu; Thermal Resistance; Thermal Shock; Voids

Indexed keywords

COPPER; FINITE ELEMENT METHOD; HEAT RESISTANCE; MATHEMATICAL MODELS; RELIABILITY; SILVER; STRESS ANALYSIS; TIN;

EQUIVALENT PLASTIC STRAIN; EQUIVALENT STRESS; THERMAL SHOCK; VOIDS;

HEAT SINKS;

EID: 33645144815     PISSN: 00432296     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

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