SCOPUS 정보 검색 플랫폼 - 논문 보기

메뉴 건너뛰기

Finite Elements in Analysis and Design

Volumn 38, Issue 7, 2002, Pages 601-612

Failure modes and FEM analysis of power electronic packaging

(3) Ye, Hua a Lin, Minghui a Basaran, Cemal a

a UNIVERSITY AT BUFFALO (United States)

Author keywords

Electronic packaging; Failure modes; Finite element analysis; IGBT; Power electronic packaging; Reliability

Indexed keywords

CYCLIC LOADS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; INSULATED GATE BIPOLAR TRANSISTORS; POWER CONVERTERS; POWER ELECTRONICS; THERMAL LOAD;

FAILURE MODES;

ELECTRONICS PACKAGING;

EID: 0036568067 PISSN: 0168874X EISSN: None Source Type: Journal
DOI: 10.1016/S0168-874X(01)00094-4 Document Type: Article

Times cited : (159)

References (24)

1
- 0033343303
- Power electronics technology at the dawn of the new millennium status and future
- Charleston SC, USA
- (1999) Pesc Record - IEEE Power Electronics Specialists Conference , vol.1 , pp. 3-12
- Van Wyk, J.D.¹ Lee, F.C.²

2
- 0008400493
- ETH Zurich, 9th. Ref Type: Report
- (1994) LESIT PZT Report , vol.L30

3
- 0032255332
- Reliability in large area die bonds and effects of thermal expansion mismatch and die size
- (1998) IMAPS J. , vol.21 , Issue.3 , pp. 297
- He, J.¹ Morris, W.L.² Shaw, M.C.³ Mather, J.C.⁴ Sridhar, N.⁵

4
- 0031378688
- Power-cycling-stability of IGBT-modules
- New Orleans LA, USA, No. 97CB36096
- (1997) Conference Record - IAS Annual Meeting (IEEE Industry Applications Society) , vol.2 , pp. 1248-1252
- Auerbach, F.¹ Lenniger, A.²

5
- 0029190556
- Investigation on the long term reliability of power IGBT modules
- No. 95CH35785, Yokohama, Japan, IEEE
- (1995) Proceedings of 1995 International Symposium on Power Semiconductor Devices and Ics , pp. 443-448
- Wu, W.¹ Held, M.² Jacob, P.³ Scacco, P.⁴ Birolini, A.⁵

6
- 0029178676
- Thermal stress related packaging failure in power IGBT modules
- No. 95CH35785, Yokohama, Japan, IEEE
- (1995) IEEE International Symposium on Power Semiconductor Devices & ICs (ISPSD) , pp. 330-334
- Wu, W.¹ Held, M.² Jacob, P.³ Scacco, P.⁴ Birolini, A.⁵

7
- 0032309837
- Direct measurement and analysis of the time-dependent evolution of stress in silicon devices and solder interconnections in power assemblies
- 98CH36242
- (1998) Conference Record - IAS Annual Meeting (IEEE Industry Applications Society) , vol.2 , pp. 1038-1045
- He, J.¹ Shaw, M.C.² Mather, J.C.³ Addison, R.C.J.⁴

8
- 0033358191
- Accelerated life testing and thermomechanical simulation in power electronic device development
- (1999) J. Strain Anal. Eng. Des. , vol.34 , Issue.6 , pp. 455-462
- Nicoletto, G.¹ Pirondi, A.² Cova, P.³

9
- 0027612158
- Failure analysis of power modules: A look at the packaging and reliability of large IGBT's
- (1993) IEEE Trans. Components Hybrids Manuf. Technol. , vol.16 , Issue.4 , pp. 412-417
- De Lambilly, H.¹ Keser, H.O.²

10
- 0032083619
- On the effect of power cycling stress on IGBT modules
- (1998) Microelectron. Reliab. , vol.38 , Issue.6-8 , pp. 1347-1352
- Cova, P.¹ Fantini, F.²

11
- 0032158076
- Packaging factors affecting the fatigue life of power transistor die bonds
- (1998) IEEE Trans. Components Packaging Manuf. Technol. Part A , vol.21 , Issue.3 , pp. 459-468
- Evans, J.¹ Evans, J.Y.²

12
- 0008373116
- Thermomechanical effects of EOS
- T. Lee, S. Pabbisetty (Eds.), ASM International, Material Park, OH
- (1993) Microelectronics Failure Analysis, Desk Reference, 3rd Edition , pp. 335-352
- Lee, T.W.¹

13
- 0018482659
- Properties of die bond alloys relating to thermal fatigue
- (1979) IEEE Trans. Components Hybrids Manuf. Technol. , vol.CHMT2 , pp. 257-262
- Olson, R.¹ Berg, M.²

14
- 0004171445
- Wiley, New York
- (1994) Quality Conformance and Qualification of Microelectronic Packaging and Interconnects , pp. 237-258
- Pecht, A.¹ Dasgupta, A.² Evans, J.³ Evans, J.⁴

15
- 0033678409
- Effects of plasticity on reliability in multilayered electronic packages
- Las Vegas NV, USA
- (2000) 2000 Inter Society Conference on Thermal Phenomena , pp. 279-285
- Shaw, M.C.¹ He, J.² Mather, J.C.³ Addison, R.C.J.⁴

16
- 0032681046
- Thermal impact of solder voids in the electronic packaging of power devices
- (1999) Annual IEEE Semiconductor Thermal Measurement & Management Symposium , pp. 22-29
- Zhu, N.¹

17
- 0026135835
- Bonding stress measurements from the degree of polarization of facet emission of AlGaAs superluminescent diodes
- (1991) IEEE J. Quantum Electron. , vol.27 , Issue.4 , pp. 914-920
- Colbourne, P.D.¹ Cassidy, D.T.²

18
- 0031623090
- Direct measurements of thermal stress distributions in large die bonds for power electronics
- (1998) Electronic Packaging Materials Science X Materials Research Society Symposium - Proceedings , vol.515 , pp. 99-104
- He, J.¹ Shaw, M.C.² Sridhar, N.³ Cox, B.N.⁴ Clarke, D.R.⁵

19
- 0032309837
- Direct measurement and analysis of the time-dependent evolution of stress in silicon devices and solder interconnections in power assemblies
- No. 98CH36242
- (1998) Conference Record - IAS Annual Meeting (IEEE Industry Applications Society) , vol.2 , pp. 1038-1045
- He, J.¹ Shaw, M.C.² Mather, J.C.³ Addison Jr., R.C.⁴

20
- 0040115139
- Thermal mechanical, and environmental duability design methodologies
- ASM International, Material park, OH
- (1988) Electronic Materials Handbooks , vol.1
- Suhir, E.¹ Lee, Y.C.²

21
- 4243554565
- Dissertation for Ph.D. degree
- (1998) Damage mechanics of microelectronic packaging under combined dynamic and thermal loading
- Rumpa, C.¹

22
- 0008364716
- ASME, New York
- (2000) Thermal Cycle Guidelines for Automotive, Computer, Portable and Implantable Medical Device Application
- Rajib, R.¹ Raghuram, V.P.² Suresh, K.S.³

23
- 0032292877
- A thermodynamic framework for damage mechanics of solder joints
- (1998) ASME J. Electron. Packaging , vol.120 , Issue.4 , pp. 379-389
- Basaran, C.¹ Yan, C.²

24
- 0032626553
- Closed form vs. finite element analysis laminated stacks
- (1999) Finite Elements Anal. Des. , vol.32 , pp. 163-179
- Basaran, C.¹ Zhao, Y.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.