Properties enhancement of SnAgCu solders containing rare earth Yb

Materials and Design

Volumn 57, Issue , 2014, Pages 646-651

  Zhang, Liang ^a,b   Fan, Xi ying ^a   Guo, Yong huan ^a   He, Cheng wen ^a  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b Engineering IV   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; MICROELECTRONICS; RARE EARTHS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; TENSILE STRENGTH; TIN;

COMPREHENSIVE PROPERTIES; FATIGUE BEHAVIOR; IMC THICKNESS; LEAD FREE SOLDERS; LEAD-FREE ALLOY; MICROELECTRONIC PACKAGING; SNAGCU SOLDER; WEIGHT FRACTIONS;

YTTERBIUM;

EID: 84893425410     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2013.12.076     Document Type: Article

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