15-μm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

Japanese Journal of Applied Physics

Volumn 53, Issue 4 SPEC. ISSUE, 2014, Pages

  Tung, Bui Thanh ^a   Kato, Fumiki ^a   Watanabe, Naoya ^a   Nemoto, Shunsuke ^a   Kikuchi, Katsuya ^a   Aoyagi, Masahiro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FLIP CHIP DEVICES;

BONDING PROCESS; CHIP STACKING; HIGH-PRECISION; LOW TEMPERATURES; MICROSTRUCTURE ANALYSIS; ROOM TEMPERATURE; SELF-CORRECTION; THERMOSONIC FLIP-CHIP BONDING;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84903318370     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.7567/JJAP.53.04EB04     Document Type: Conference Paper

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