Room-temperature bonding using mechanical caulking effect of compliant bumps for chip-stack interconnection

Japanese Journal of Applied Physics

Volumn 49, Issue 4 PART 2, 2010, Pages

  Watanabe, Naoya ^a   Asano, Tanemasa ^a  

^a KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT AIR; ATOMIC LEVELS; AU CONE; COMPLIANT BUMP; HIGH-DENSITY; INTER-CHIP; MATERIAL ANALYSIS; ROOM TEMPERATURE; THREE-DIMENSIONAL (3D);

BONDING; ELECTRODES; THREE DIMENSIONAL;

GOLD;

EID: 77952692895     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.49.04DB02     Document Type: Article

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