Erratum: Sub-micron-accuracy gold-to-gold interconnection flip-chip bonding approach for electronics-optics heterogeneous integration (Japanese Journal of Applied Physics (2013) 52 04CB08)

Japanese Journal of Applied Physics

Volumn 52, Issue 6 PART 1, 2013, Pages

  Bui, Tung Thanh ^a   Suzuki, Motohiro ^a   Kato, Fumiki ^a   Nemoto, Shunsuke ^a   Watanabe, Naoya ^a   Aoyagi, Masahiro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84881045039     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.7567/JJAP.52.069202     Document Type: Erratum

References (0)