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Journal of Physics D: Applied Physics

Volumn 34, Issue 24, 2001, Pages 3515-3521

Thermosonic wire bonding of gold wire onto copper pad using the saturated interracial phenomena

(3) Jeng, Y R a Aoh, J H a Wang, C M a

a NATIONAL CHUNG CHENG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER; GOLD; INTERFACES (MATERIALS); SHEAR STRESS; ULTRASONIC APPLICATIONS; WELDING;

THERMOSONIC WIRE BONDING;

WIRE;

EID: 0035930850 PISSN: 00223727 EISSN: None Source Type: Journal
DOI: 10.1088/0022-3727/34/24/316 Document Type: Article

Times cited : (21)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.