Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Micromachines

Volumn 2, Issue 1, 2011, Pages 49-68

  Fukushima, Takafumi ^a   Konno, Takayuki ^a   Iwata, Eiji ^a   Kobayashi, Risato ^a   Kojima, Toshiya ^a   Murugesan, Mariappan ^a   Bea, Ji Chel ^a   Lee, Kang Wook ^a   Tanaka, Tetsu ^a   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Cavity chip; Direct bonding; Hetero integration; Liquid; Room temperature bonding; Self assembly; Surface tension

Indexed keywords

ALIGNMENT ACCURACY; BONDING REGION; BONDING STRENGTH; CAVITY CHIP; CAVITY STRUCTURE; CHIP PERIPHERY; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; DIRECT BONDING; HIGH SHEAR; HIGH-PRECISION; HYDROGEN FLUORIDE; HYDROPHILIC BONDING; MICRO ELECTROMECHANICAL SYSTEM (MEMS); PACKAGING TECHNOLOGIES; ROOM TEMPERATURE; SI SUBSTRATES; SIDE LENGTH; SMALL DROPLETS; SURFACE MOUNTING; THERMAL COMPRESSIONS;

ALIGNMENT; BONDING; DROP FORMATION; ELECTROMECHANICAL DEVICES; INTEGRATION; LIQUIDS; MEMS; SELF ASSEMBLY; SURFACE MOUNT TECHNOLOGY; SURFACE TENSION;

CHIP SCALE PACKAGES;

EID: 79960415156     PISSN: None     EISSN: 2072666X     Source Type: Journal    
DOI: 10.3390/mi2010049     Document Type: Article

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