Submicron aligned wafer bonding via capillary forces

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 25, Issue 6, 2007, Pages 1976-1981

  Tupek, Michael R ^a   Turner, Kevin T ^a  

^a University of Wisconsin Madison   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FORCES; SUBMICRON WAFERS;

DIGITAL INTEGRATED CIRCUITS; DROP FORMATION; ERROR ANALYSIS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS;

WAFER BONDING;

EID: 37149034345     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2787866     Document Type: Article

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