Formation and growth of intermetallic compounds in Cu-Au and Au-Al systems for copper on gold bonding

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 33, Issue 3, 2010, Pages 228-235

  Jiang, Yingwei ^a,b   Sun, Ronglu ^a   Yu, Youmin ^c   Wang, Zhijie ^d   Chen, Weimin ^d  

^a TIANJIN POLYTECHNIC UNIVERSITY   (China)

^b FREESCALE SEMICONDUCTOR INC   (United States)

^c UNIVERSITY OF MINNESOTA   (United States)

^d Freescale Semiconductor ^*  (China)

Author keywords

Copper ball on gold bump (COG); crater; inter diffusion; intermetallic compound (IMC)

Indexed keywords

AL-METALLIZATION; BALL SHEAR; BOND PAD; BONDING STRENGTH; CRATER; CU WIRE BONDINGS; CU-AU INTERFACE; GOLD BUMPS; GROWTH OF INTERMETALLICS; HIGH TEMPERATURE; INTER-DIFFUSION; INTERMETALLIC COMPOUND (IMC); INTERMETALLIC COMPOUNDS; LARGE INTEGRATED CIRCUITS; MECHANICAL PERFORMANCE; PATTERN DESIGNS; RELIABILITY TEST; TEMPERATURE CYCLES; WIRE BONDING; WIREBONDER;

ALUMINUM; COPPER; DIFFUSION BONDING; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; SPHERES; WIRE;

GOLD;

EID: 77955714983     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2010.2053544     Document Type: Conference Paper

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