Bonding mechanism in ultrasonic gold ball bonds on copper substrate

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 36, Issue 5, 2005, Pages 1279-1286

  Lum, I ^a   Jung, J P ^a,b   Zhou, Y ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

^b University of Seoul   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEFORMATION; ELECTRIC PROPERTIES; GOLD; INTERFACES (MATERIALS); MATHEMATICAL MODELS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; TRANSMISSION ELECTRON MICROSCOPY; ULTRASONIC APPLICATIONS; YIELD STRESS;

BOND FORMATION; BONDING MECHANISM; COPPER SUBSTRATES; ULTRASONIC GOLD BALL BONDS;

SOLDERING;

EID: 21244480155     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-005-0220-2     Document Type: Conference Paper

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